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Item ID 2582910 in Category: Computers - Hardware

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SiP package substrate


Substrates for high-performance SiP packaging can be made with the right materials, the right layering, a higher wiring density, and effective signal and thermal control. After that, these companies hire a foundry to make their proprietary SiP package substrate devices, which are only used in the company's equipment.

Contact Info:-

High Quality PCB Co., Limited

Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China

Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China

Plant 2 address: Zhuhai, Guangdong, China

Plant 3 address: Dongguan, Guangdong, China

TEL: +86-755-23724206

WhatsApp: +86-189 2381 2997

Skype: shawnwang2006

Email: sales@efpcb.com



Target State: All States
Target City : Shenzhen
Last Update : Mar 31, 2025 11:31 AM
Number of Views: 29
Item  Owner  : Shawn Wang
Contact Email:
Contact Phone: +86-755-23724206

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