BGA assembly (Computers - Hardware)

Item ID 2670016 in Category: Computers - Hardware

BGA assembly
Along with the rapid growth of extremely large-scale integrated circuits (ICs), existing package types can never meet electronics assembly demands, and fresh packages emerge as a result of increased demand for greater integrity, lower board space, and larger I/O count. Among all of the newer forms of packages, the BGA (ball grid array) package is the major type with the broadest application areas because of its variety, which overcomes many constraints seen in older packages. In terms of soldering technology, the BGA assembly is quite similar to previous packages. Contact Info:- High Quality PCB Co., Limited Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China Plant 2 address: Zhuhai, Guangdong, China Plant 3 address: Dongguan, Guangdong, China TEL: +86-755-23724206 WahtsApp: +86-189 2381 2997 Skype: shawnwang2006 Email: sales@efpcb.com
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Target State: All States Target City : Shenzhen Last Update : Jul 01, 2024 5:23 AM Number of Views: 106	Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206

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2024-11-23 (0.382 sec)