DBC ALN Ceramic Plate Direct Bonded Copper Ceramic Substrate (Computers - Hardware)

Item ID 2717643 in Category: Computers - Hardware

DBC ALN Ceramic Plate Direct Bonded Copper Ceramic Substrate
DBC ALN Ceramic Plate Direct Bonded Copper Ceramic Substrate Product Description: Material: Ceramics Place of Origin: Guangdong, China Product Applications: Cooling, heat dissipation Package: Standard export package Paymant terms: T/T, L/C, Paypal, Direct bonded copper (DBC) substrates are commonly used in power modules, because of their very good thermal conductivity. They are composed of a ceramic tile (commonly alumina) with a sheet of copper bonded to one or both sides by a high-temperature oxidation process (the copper and substrate are heated to a carefully controlled temperature in an atmosphere of nitrogen containing about 30 ppm of oxygen; under these conditions, a copper-oxygen eutectic forms which bonds successfully both to copper and the oxides used as substrates). The top copper layer can be preformed prior to firing or chemically etched using printed circuit board technology to form an electrical circuit, while the bottom copper layer is usually kept plain. The substrate is attached to a heat spreader by soldering the bottom copper layer to it.

Target State: All States Target City : All Cities Last Update : Aug 20, 2024 2:52 AM Number of Views: 39	Item Owner : Geatcoler Contact Email: Contact Phone: (None)

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2024-11-23 (0.386 sec)