Understanding MEMS Substrates: The Core of MEMS Systems (Computers - Hardware)

Item ID 2809598 in Category: Computers - Hardware

Understanding MEMS Substrates: The Core of MEMS Systems


Mass Micromachining: In mass micromachining, silicon wafers are scratched to make three-layered structures. Procedures, for instance, wet scratching and dry cutting are used to explicitly wipe out silicon, shaping features like channels, melancholies, and channels.

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Last Update : Nov 27, 2024 10:25 AM
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