CSP Substrate Technology: Fundamentals and Applications (Computers - Hardware)

Item ID 2835645 in Category: Computers - Hardware

CSP Substrate Technology: Fundamentals and Applications
CSP substrate is one of the IC bundling advancements that is utilized in the arrangement of microelectronic frameworks. The size of the bundle really depends on 1 and it very well may be a blend of parts of the number or just the initial segment. Twice the pass on size of the real kick the bucket with a solitary bite the dust bundle which has direct surface mounts capacity. It was first evolved during the 1990s because of enormous prerequisites for little as well as productive bundles. Contact info:- https://efpcb.wordpress.com/2024/09/25/csp-substrate-technology-fundamentals-and-applications/
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Target State: All States Target City : Shenzhen Last Update : Dec 28, 2024 8:49 AM Number of Views: 51	Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206

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2025-01-15 (0.392 sec)