SiP package substrate (Computers - Hardware)

Item ID 2916027 in Category: Computers - Hardware

SiP package substrate
Substrates for high-performance SiP packaging can be made with the right materials, the right layering, a higher wiring density, and effective signal and thermal control. After that, these companies hire a foundry to make their proprietary SiP package substrate devices, which are only used in the company's equipment. Contact Info:- High Quality PCB Co., Limited Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China Plant 2 address: Zhuhai, Guangdong, China Plant 3 address: Dongguan, Guangdong, China TEL: +86-755-23724206 WhatsApp: +86-189 2381 2997 Skype: shawnwang2006 Email: sales@efpcb.com

Target State: All States Target City : Shenzhen Last Update : Mar 31, 2025 11:31 AM Number of Views: 27	Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206

Friendly reminder: Click here to read some tips.

2025-04-04 (0.541 sec)